Likesmile Silicon Wafer Grinding Equipment for Semiconductor Factory

• Customization: Available
• Warranty: 1 Year
• Material: Copper
• Model NO.: BW
• Core Components: PLC
• Machinery Test Report: Provided
• Video Outgoing-Inspection: Provided
• Power (Kw): 1.5
• Weight (Kg): 600
• Machining Accuracy: High Precision
• Grinding Wheel Speed: 60 (Rpm)
• Maximum Grinding Size: 110 (mm)
• Control Method: CNC
• Transport Package: 700*950*1950mm
• Trademark: BW
• Origin: Jiangsu, China
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 100.000kg

Product Description

Production process

Can build a complete silicon wafer production line

Equipment Features

1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation.

2. The grinding machine employs four pressure levels: light pressure, medium pressure, heavy pressure, and finishing. 

3. The grinding machine uses push-button operation with variable frequency speed control; motor speed and running time can be directly input on the control panel.

Equipment Features

4. The grinding disc can be freely raised and lowered, and can be manually adjusted, ensuring excellent stability.

 5. The upper disc is equipped with a separate slow-descent cylinder, which not only effectively prevents breakage of thin and brittle workpieces but also allows for independent pressure control.

 6. The number of grinding revolutions and desired results can be accurately controlled using an electronic preset counter.

Equipment Features

7. Diamond dressing wheels can be used for disc dressing.

8. The large-size drive shaft design enhances shaft rigidity, thereby eliminating vibrations caused by insufficient rigidity.